DeepMaterial Epoxy-Based COB Encapsulation UV Curing Adhesives
DeepMaterial’s COB encapsulation UV curing adhesive can be heat cured or UV-cured with high reliability and low thermal swelling coefficient, as well as high glass conversion temperatures and low ion content. DeepMaterial’s COB encapsulating UV curing adhesives protect wire leads, plumbum, chrome and silicon wafers from the external environment, mechanical damage and corrosion.
COB encapsulant can be used for wire bonding to provide environmental protection and increase mechanical strength. The protective sealing of wire-bonded chips includes top encapsulation, cofferdam, and gap filling. Adhesives with fine-tuning flow function are required, because their flow ability must ensure that the wires are encapsulated, and the adhesive will not flow out of the chip, and ensure that can be used for very fine pitch leads.
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Product Name
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Low temperature UV curing adhesives
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Material
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Epoxy resin based
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Function
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CCD or CMOS components, VCM motor assembly
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Volume
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30~50ml/pcs
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Color
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White
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Application
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| Lead, epitaph and silicon wafers Protection from environmental, mechanical damage and corrosion. |
Lead bonding chip Encapsulation, cofferdam, and gap filling |
Flip chip CCD/CMOS component and VCM motor assmbly |
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