Product Seriess |
Product name |
Product typical application |
Optical Organic Silica Gel |
DM-7816 |
Mini-LED silicone lens molding adhesive has good adhesion, high strength and good formability. It can be formed into a full hemispherical shape by dispensing or spraying. After curing, it has high transparency, good light emitting effffect, and has the characteristics of moisture-proof, waterproof, weather aging resistance. It is mainly used in Mini-LED chip packaging. |
DM-7817 |
Mini LED silicone sealant is suitable for dam fifilling and packaging process. After curing, it provides high refractive index while maintaining high transparency, which helps to improve the light effiffifficiency of backlight module, and has the characteristics of moisture-proof, waterproof, weather aging resistance, etc., which is mainly used in Mini-LED chip packaging. |
DM-7818 |
Mini LED silicone sealant is suitable for dam fifilling and packaging process. After curing, it provides high refractive index while maintaining high transparency, which helps to improve the light effiffifficiency of backlight module, and has the characteristics of moisture-proof, waterproof, weather aging resistance, etc., which is mainly used in Mini-LED chip packaging. |
Silicone Sealant |
DM-7880 |
A two-component heat-curing silicone packaging adhesive, designed for mini-LED COB packaging process, has low viscosity, good leveling property and is easy to inject. After curing, the adhesive surface is flflat, smooth, without bubbles, with low internal stress, and excellent high temperature resistance and good adhesion. |
DM-7882 |
A two-component heat-curing silicone packaging adhesive, designed for the mini-LED COB packaging process, has low viscosity, good leveling property and is easy to inject. After curing, the adhesive surface is flflat, smooth, without bubbles, with low internal stress, and excellent high temperature resistance and good adhesion. |
Silicone solid crystal adhesive |
DM-7814 |
Product developed to meet the high-end packaging technology of LED in the market. It is suitable for various LED packaging and crystal fifixation. After curing, it has low internal stress, strong adhesion, high temperature resistance, low yellowing, and good weather resistance. |