Xabagta Epoxy

DeepMaterial waxay bixisaa qulqulo cusub oo xididada hoose oo loogu talagalay chip flip, CSP iyo aaladaha BGA. DeepMaterial's cusub ee qulqulka xididada hoostooda ayaa ah dareere sare, nadiif sare, agab dheri ka kooban hal qayb oo samaysa labbis, lakabyo aan faaruq lahayn oo wanaajinaya isku halaynta iyo sifooyinka farsamada ee qaybaha iyada oo meesha laga saarayo walbahaarka ay keenaan alaabta alxanka. DeepMaterial waxay bixisaa habayn loogu talagalay buuxinta degdega ah ee qaybo aad u fiican, awood daaweyn degdeg ah, shaqo dheer iyo cimri dherer, iyo sidoo kale dib u shaqaynta. Dib-u-shaqayntu waxay badbaadisaa kharashaadka iyadoo u oggolaanaysa ka saarida buuxinta si dib loogu isticmaalo guddiga.

Isku-dubbaridka jajabku wuxuu u baahan yahay dhimista walaaca ee tolidda alxanka mar labaad gabownimada kulaylka dheer iyo nolosha wareegga. CSP ama kulanka BGA wuxuu u baahan yahay isticmaalka hoos-u-buuxinta si loo hagaajiyo daacadnimada makaanikada ee golaha inta lagu jiro rogrogmida, gariirka ama tijaabada dhibicda.

Buuxinta DeepMaterial's flip-chip-hoosaadka ayaa leh waxyaabo buuxinaya heer sare iyadoo lagu ilaalinayo qulqulka degdega ah ee meelaha yar yar, iyada oo awood u leh in ay yeelato heerkul sare oo dhalada ah iyo modules sare. Buuxintayada CSP-ga hoose waxaa lagu heli karaa heerar buuxin oo kala duwan, oo loo xushay heerkulka kala-guurka dhalada iyo moduleska codsiga loogu talagalay.

COB encapsulant waxaa loo isticmaali karaa isku xidhka siliga si loo bixiyo ilaalinta deegaanka loona kordhiyo xoogga farsamada. Xiritaanka difaaca ee chips-ku-xidhan ee siliga ku xidhan waxa ka mid ah xidhidaynta sare, sanduuqa kaydinta, iyo buuxinta faraqa. Xabagyada leh hab-socodka qulqulka hagaajinta ayaa loo baahan yahay, sababtoo ah awooddooda qulqulka waa inay hubisaa in fiilooyinka la duubo, oo koollada kama soo baxayso chip-ka, oo ay xaqiijiyaan in loo isticmaali karo haad aad u fiican.

Xabagta DeepMaterial ee COB waxay noqon kartaa kuleyl ahaan ama UV la daaweeyay DeepMaterial's COB koollada koollada waxaa lagu daaweeyaa kulaylka ama UV-lagu daaweeyay isku halaynta sare iyo bararka kulaylka hooseeya, iyo sidoo kale heerkulka beddelka dhalada sare iyo nuxurka ion hooseeya. DeepMaterial's COB koollada koofiyadu waxay ka ilaalisaa sunta rasaasta iyo plumbum, chrome iyo silikoon waferrada deegaanka dibadda, burburka farsamada iyo daxalka.

DeepMaterial COB koollada koodhadhka leh waxaa lagu sameeyay epoxy kulayl-daaweeya, akril UV-curing, ama kimistari silikoon ah oo dahaaran koronto oo wanaagsan. DeepMaterial COB koollada koodhadhka leh waxay bixiyaan xasillooni heerkul sare oo wanaagsan iyo caabbinta shoogga kulaylka, guryaha korantada ka ilaaliya kala duwanaanshiyaha heerkul ballaadhan, iyo yaraanta hoose, walbahaarka hoose, iyo caabbinta kiimikaad marka la daweeyo.

Deepmaterial waa xabagta ugu sareysa ee koollada qaab dhismeedka aan biyuhu lahayn ee caag ah ilaa birta iyo soo saaraha dhalada, soo saara koolada epoxy koollada aan lahayn ee koollada koollada ee pcb, koollada semiconductor ee golaha elektiroonigga ah, daawaynta heerkulka hooseeya bga flip chip underfill PCb epoxy geeddi-socodka koollada koollada iyo wixii la mid ah on