DeepMaterial Epoxy-based COB Encapsulation UV Curing Adhesives
DeepMaterial's COB encapsulation UV daawaynta xabagta waxaa lagu daaweeyaa kulaylka ama UV-ku daaweeyay isku halaynta sare iyo bararka kulaylka hooseeya, iyo sidoo kale heerkul beddelka dhalada sare iyo waxa ku jira ion hooseeya. DeepMaterial's COB koofiyado UV-da-xabagta ayaa ka ilaalisa fiilooyinka, plumbum, chrome iyo waferrada silikoonka deegaanka dibadda, burburka farsamada iyo daxalka.
COB encapsulant waxaa loo isticmaali karaa isku xidhka siliga si loo bixiyo ilaalinta deegaanka loona kordhiyo xoogga farsamada. Xiritaanka difaaca ee chips-ku-xidhan ee siliga ku xidhan waxa ka mid ah xidhidaynta sare, sanduuqa kaydinta, iyo buuxinta faraqa. Xabagta leh hawlaha qulqulka hagaajinta wanaagsan ayaa loo baahan yahay, sababtoo ah awooddooda qulqulka waa inay xaqiijiyaan in fiilooyinka la duubo, oo koollada aysan ka soo bixi doonin jajabka, iyo in la hubiyo in loo isticmaali karo hoggaan aad u fiican.
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Product Name
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Heerkulka hoose ee UV ee daawaynaya xabagta
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Waxyaabaha
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Epoxy resin ku salaysan
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function
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Qaybaha CCD ama CMOS, isu imaatinka VCM
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mugga
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30-50ml/pcs
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Color
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White
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Codsiyada Shaqaalaha Cusub
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| Lead, epitaph iyo maraqa silikoon Ka ilaalinta deegaanka, burburka farsamada iyo daxalka. |
Chip isku xidhka rasaasta Soo koobid, sanduuqa kaydinta, iyo buuxinta faraqa |
Daboolka roga Qaybta CCD/CMOS iyo isku xidhka matoorka VCM |
Faallooyin
Waxaa jira dib u eegista lahayn weli.